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Cellpack 250354 CP-FLM 20 peeling device

Brand:Cellpack
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SKU:901450
Cellpack 250354 CP-FLM 20 peeling device
HAB
Manufacturer
HAN
GTIN
In stock
€1,082.47
11
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Description
Features
Reviews

Peeling device for peeling off the firmly extruded outer conductive layer. Areas of application: Cutting and peeling off the firmly extruded outer conductive layer. Properties: Min. cutting dimension approx. 30 mm, adjustable peeling depth 0 - 1.2 mm with 0.1 mm fine gradation, guarantees a consistently good quality of the peeling surface, hard metal peeling blade, working range 10 - 50 mm, defined final round cut, peeling starts directly at the end of the cable, automatic work feed. Scope of delivery: Peeling device, assembly instructions.

PropertyValue
Notch depth adjustable:yes
Longitudinal cut:no
Round cut:yes
Spiral cut:no
Stripping range diameter:10 to 50 mm
Replaceable blades:yes
Features
HAB
Manufacturer
HAN
GTIN
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